Supermicro has a new FatTwin
IDF 2012: Flexible, modular, and not a sibling
Supermicro has a new chassis out called the F617R2-F, also known as the FatTwin 2.
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Supermicro has a new chassis out called the F617R2-F, also known as the FatTwin 2.
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Just when you thought laptop monitors were nearing their quality bottom, Toshiba comes up with a really interesting panel.
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If you were thinking that Microsoft could not make their server line less palatable, Windows Server 2012 Essentials will prove you wrong.
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The best tech shown at IDF so far was the new SeaMicro box from AMD, say hi to the SM15000.
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Intel – logoWe know about Haswell’s massive shader count, and we know why it has them, but what is Crystalwell exactly?
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Haswell may have the shaders to be a graphics monster, but it isn’t going to use them that way.
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Semiaccurate has learned that Intel intends to do away with DIMMs, DRAM, and any other sort of user addable memory.
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At Hot Chips 24, AMD’s Mark Papermaster gave a keynote speech that had a few technical tidbits in it.
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The three most pressing problems of modern silicon design, power, I/O pins, and yields can all be addressed by chip stacking.
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A new HPC data center is going in at the National Renewable Energy Lab featuring two types of Xeons and warm water cooling courtesy of HP.
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It seems that AMD is having a little bit of a me-too moment in the wireless display category.
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Hot Chips 24 had their usual tutorials on the first day, and this year the second topic, chip stacking, was of particular interest to SemiAccurate.
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Will foundries bite the release schedule of the XBox Next, or will Microsoft keep the dates they have told those in the know?
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Last year Intel introduced the first products based off of its proprietary Thunderbolt interface.
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